Originally developed in Japan by WINS Co. Ltd., now enhanced by RMEC with higher sensitivity, higher throughput, wider applications and richer features, FSD300 Automatic Macro Defect Inspection Tool aims to deliver to our customers with high performance-to-cost ratio.
System Descriptions
Highlights
Low cost of ownership
High stability and high reliability
Very small foot print at 2.03x1.8 m2
Bare, filmed & patterned wafer capabilities
Wafer back side inspection (optional)
Sensitivity down to 3 um particle size (PSL)
100 WPH throughput (standard mode)
100% surface scan
GEM/SECS support
Wide Applications
Front-end FAB : OQC/CMP/IQC/ADI/AEI/Film
Back-end Packaging : Probing/Bumping/TSV
Others : LED/Solar
Engineering Cost Saving
Auto recipe creation
Recipe setup within 10 minutes
Simple tuning to optimize the detection parameters
Reducing Time to Decision in Production
Defect binning capability to tighten SPC
On-the-fly inspection patch images for the first line review Global scan image capture for wafer level process control
Early excursion alarming to correct out-spec variation and processing failure
Output industry standard format to integrate yield management
FSD300 Specifications 性能指标
Imaging TechIllumination SourceWhite Light LED
Imaging SystemDark Field
Monochrome Line Scan
PerformanceSingle Pixel Size14um
SensitivityDown to 3um particle (PSL)
Capture Rate> 95% @10um PSL (unpatterned)
> 95% @10um RSW (patterned)
False Rate< 5%
Repeatability> 95%
Throughput100 WPH
FeatureInspection ModesFront side inspection – standard
Back side inspection – optional
Inspection AlgorithmsMultiple and Proprietary (unpatterned and patterned)
DetectionLocal and Global Defects
ClassificationReal Time and Automatic
Result OutputFSD Format with Optional KLARF-Compatible Support
Image OutputPatch and Whole Wafer Images
Fab AutomationGEM/SECS Support
Recipe Setup TimeWithin 10 min
ReliabilityUp Time> 95%
MTBF> 1000 hours
MTTR< 4 hours
MTBA> 72 hours
MTTA< 4 hours
Wafer Breakage< 1/100000 Wafers
SystemWafer Size300 mm
Loadport ConfigurationFOUP
Footprint2.03 x 1.8 m2
Power SupplyAC 3-Phase 208V 50/60Hz, 30A * 1
CDAPressure: 0.5 to 0.8 MPa
Flow Rate: 200 l/min and 5 kgf/cm2
Diameter: Φ8mm * 1
VacuumPressure: -60 to -80 KPa
Flow Rate: 0.34 sm3/h
Diameter: Φ6mm * 1
