TFX3000 OCD is fully automatic optical critical dimension (OCD) and shape measurement system for integrated circuit production line 300mm silicon chip. RSIC possesses full independent intellectual property rights of TFX3000 OCD system. The TFX3000 OCD can be used to fully characterize and monitor line-width, side wall angle (SWA), height/depth, related CD features and whole shape of 2D/3D samples in after developing inspection (ADI) or after etching inspection (AEI) process. It can measure 2D polycrystalline silicon grid etching, STI, Spacer, Double Patterning, VIA, FinFET, NAND, etc. It has high speed, accuracy, and non-destructive characteristics.